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Тест №70-571: TS: Microsoft Windows Embedded CE 6.0, Development

Языки теста: English
Online тест:
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Audience Profile
Candidates for this exam have two to three years of experience in an embedded system environment developing for embedded devices by using Windows Embedded CE. Candidates should also have at least one year of experience using Windows Embedded CE and six months of experience using Windows Embedded CE 6.0. Candidates usually fill the role of embedded developer, embedded engineer, device driver developer, board support package engineering developer, field application engineer, and quality assurance engineer. Candidates typically develop, implement, test, and support embedded devices.
In addition, candidates should have a good understanding of Microsoft Visual Studio 2005 with Platform Builder, C, and C++.
Credit Toward CertificationWhen you pass Exam 70-571: TS: Microsoft Windows Embedded CE 6.0, Development, you complete the requirements for the following certification(s):
  • Microsoft Certified Technology Specialist (MCTS): Windows Embedded CE 6.0
Skills Being MeasuredThis exam measures your ability to accomplish the technical tasks listed below.The percentages indicate the relative weight of each major topic area on the exam.The higher the percentage, the more questions you are likely to see on that content area on the exam.

The information after “This objective may include but is not limited to” is intended to further define or scope the objective by describing the types of skills and topics that may be tested for the objective. However, it is not an exhaustive list of skills and topics that could be included on the exam for a given skill area. You may be tested on other skills and topics related to the objective that are not explicitly listed here.
Customizing the Operating System Design (12 percent)
  • Configure the operating system (OS) design. May include but is not limited to: Create initial OS design for given board support package (BSP)/hardware; set the environment variables, build options, and regional settings; manage multiple configurations (for example, release/debug); identify appropriate catalog items; modify a build configuration to add a new catalog item to OS design
  • Configure Windows Embedded CE projects.
  • Clone a component.
  • Generate a software development kit (SDK). May include but is not limited to: Create an SDK; configure an SDK; build an SDK
  • Manage catalog items. May include but is not limited to: Integrate an existing driver into a Windows Embedded CE development environment; create a catalog item; verify and correct contents of a catalog file
Building and Deploying the Runtime Image (9 percent)
  • Build the runtime image. May include but is not limited to: Build from the IDE; build from the command line
  • Analyze build results. May include but is not limited to: Interpret build failures; check build status; identify hidden failures (those not identified by IDE as build failures)
  • Deploy the runtime image to target hardware. May include but is not limited to: Configure Platform Builder options; download operating system to the target hardware; connect to a target hardware
Performing System Programming (22 percent)
  • Monitor and optimize system performance.
  • Implement system applications. May include but is not limited to: Implement control panel applet; launch a custom shell
  • Implement threads and thread synchronization.
  • Implement exception handling.
  • Implement power management at the system level. May include but is not limited to: Application-level power management; power management scheme; Power Manager configuration
Debugging and Testing the System (17 percent)
  • Detect software-related errors. May include but is not limited to: Detect driver memory leaks; detect deadlocks; detect race conditions
  • Configure the runtime image to enable debugging. May include but is not limited to: Entire image or individual module; enable profiling in the OEM Abstraction Layer (OAL)
  • Test a system by using Windows Embedded CE 6.0 Test Kit (CETK). May include but is not limited to: Use existing CETK tests, including Stress test; create custom tests
  • Test a boot loader.
Customizing a Board Support Package (BSP)(17 percent)
  • Configure a BSP. May include but is not limited to: Modify parameter files (bib, reg, dat files); modify build files
  • Add power management support to an OEM Abstraction Layer (OAL).
  • Configure memory mapping of a BSP.
  • Implement a boot loader from existing libraries.
  • Share driver resources between hardware and an OAL. May include but is not limited to: Shared memory; shared interrupts; shared I/O
Developing Device Drivers (23 percent)
  • Marshall data across boundaries. May include but is not limited to: Implement a data exchange mechanism between a driver and an application; implement communication between drivers and hardware; load a driver
  • Implement an interrupt mechanism in a device driver. May include but is not limited to: Implement an interrupt service thread (IST); communication between interrupt service routine (ISR) and IST; IRQ vs. SYSINTR; Installable ISR
  • Implement a stream interface driver.
  • Enhance driver portability. May include but is not limited to: Package should be hardware-target independent; BUS-agnostic hardware access


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